Tungsten-rhenium Alloy Electronic Packaging Chip

Product Description

Tungsten-rhenium alloy electronic packaging material utilizes the characteristics of tungsten and has the high thermal conductivity of copper. Its thermal expansion coefficient and electrical and thermal conductivity can be changed by adjusting the composition of the material, thus providing convenience for the use of the material.

Use

Tungsten-rhenium alloy electronic packaging chip is mainly used for heat exchange in refrigeration and air conditioning systems and automotive radiators (heat exchangers). Electronic packages are also used in electronic products for thermal management, often in computer central processing units (CPUs) or graphics processors.

Effect

Tungsten-rhenium alloy encapsulation sheets also help cool electronic and optoelectronic devices, such as high-power lasers and light-emitting diodes (LEDs), and their physical design facilitates cooling of surrounding fluids, such as increased surface area for air contact. Accelerated air velocity, material selection design and surface treatment thermal resistance, that is, thermal performance, electronic packaging chips, are factors that affect design. In a computer's central processing unit (CPU) or graphics processor, the electronic package chip has an approach to these essential attachments and the thermal interface material can affect the final junction that dissipates the temperature of the processor(s). Thermal silicone (aka thermal grease) is added to the top of the heat sink to aid in its ability to dissipate heat. Experimental property values can determine the thermal performance of an electronic package.

Material advantage

Tungsten-rhenium alloy electronic packaging materials utilize the low expansion characteristics of tungsten and the high thermal conductivity of copper. Its thermal expansion coefficient and electrical and thermal conductivity can be changed by adjusting the composition of the material, thus providing convenience for the use of the material.

Other uses of materials

1. Resistance welding electrode: Combining the advantages of tungsten and copper, high temperature resistance, arc ablation resistance, high strength, high specific weight, good electrical conductivity, thermal conductivity, easy cutting and processing, and has the characteristics of sweating and cooling. The characteristics of high hardness, high melting point and anti-adhesion are often used to make projection welding and butt welding electrodes with certain wear resistance and high temperature resistance.

2. EDM electrode: When electric corrosion is required for molds made of tungsten steel and high-temperature-resistant superhard alloy, ordinary electrodes have large loss and slow speed, while tungsten copper has high electric corrosion speed, low loss rate, and precise electrode shape. Excellent processing performance can ensure that the accuracy of the workpiece to be processed is greatly improved.

3. High-voltage discharge tube electrode: When the high-voltage vacuum discharge tube is working, the temperature of the contact material will rise by several thousand degrees Celsius in a few tenths of a second, while tungsten copper has anti-ablation performance, high toughness, and good electrical and thermal conductivity. The performance provides the necessary conditions for the stable operation of the discharge tube.

Outlook

After research and development, the preparation technology of tungsten-rhenium alloy has made great progress, and some new processes and technologies have been promoted and applied in production, but in order to meet the increasing performance requirements and application requirements under some special conditions, still There are some issues that need more in-depth research. First of all, the basic research on the forming technology of tungsten-rhenium-based alloys should be strengthened to guide the development of new technologies. Because most of the research focuses on how to prepare high-performance alloys, while ignoring the research on basic theory, this also results in a situation where theory and technology are out of touch. For example, in the research on the development of microalloyed tungsten-rhenium-based alloys, the influence of added elements on the electrical and thermal conductivity and performance needs to be further studied in order to truly provide theoretical guidance for new preparation technology. Secondly, although some research has been done on the new preparation technology in China, the research is generally not deep enough, and because the required equipment is expensive and the process method is relatively complicated, it is difficult to apply it in industrial production. Therefore, we should vigorously develop high-efficiency, low-cost, widely applicable, and easy-to-master manufacturing technologies to meet the needs of technological progress and actual production. Throughout the history of the development of tungsten-rhenium alloy materials, with the progress of basic research and the improvement of preparation technology, the performance of tungsten-rhenium alloy has been greatly improved, and it has also provided a broader scope for the expansion of the application field of tungsten-rhenium alloy. prospect.

Metal Injection Molding Process

Detection Systems