Tungsten Copper Alloy Gold-plated Heat Sink Sheet Metal Injection Molding MIM Parts

Features

1. Power electronic devices and circuits will generate a lot of heat when running. Heat sink materials help to remove chip heat, transfer it to other media, and maintain stable chip operation.

2. It has a thermal expansion coefficient and high thermal conductivity that matches different substrates; excellent high-temperature stability and uniformity; excellent processing performance;

3. Tungsten copper alloy is a two-phase structure pseudo alloy with tungsten as the base and copper as the secondary component. It is a composite material in metal. Tungsten copper electronic packaging sheet has both the low expansion characteristics of tungsten and the high thermal conductivity of copper. What is particularly valuable is that its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of the material, which brings great convenience to the application of the material. We use high-purity and high-quality raw materials, and after pressing, high-temperature sintering and infiltration, we obtain WCu electronic packaging materials and heat sink materials with excellent performance.

Application:

1. Materials suitable for packaging with high-power devices, such as substrates, electrodes, etc.; high-performance lead frames; thermal control plates and radiators of thermal control devices, etc.

2. Molybdenum copper, tungsten copper, copper-molybdenum-copper (CMC), copper-molybdenum copper-copper (Cu/Mo Cu/Cu) and multilayer copper-aluminum-copper (S-CMC) materials combine the low thermal expansion rate of molybdenum and tungsten with the high thermal conductivity of copper, which can effectively release the heat of electronic devices and help cool various products such as IGBT modules, RF power amplifiers, LED chips, etc. They can be used in large-scale integrated circuits and high-power microwave devices as metal substrates, thermal control plates, heat sink materials and lead frames.

Qinhuangdao Zhongwei Precision Machinery Co., Ltd. was established in 1997.

Advantages Of Our Company's Tungsten Copper And Tungsten Rhenium Alloys

1. No sintering activation elements are added, maintaining good thermal conductivity;

2. The metallographic appearance of the product shows that there is no copper pool phenomenon;

3. Relative density ≥ 99%, low porosity, good product air tightness, helium mass spectrometer leak test ≤ 5 × 10-9Pa·m3/S can be fully passed;

4. Good size control, surface finish and flatness;

5. Good electroplating quality and heat shock resistance.

We can provide tungsten copper sheets with specifications ranging from (0.1~10.0) mm×(10~200) mm×(30~500) mm, and can also provide deeply processed tungsten copper precision parts.