Gold-plated Metal Injection Molding MIM Parts Of Tungsten Copper Alloy Packaging Sheet
Gold-plated Metal Injection Molding MIM Parts Of Tungsten Copper Alloy Packaging Sheet
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Gold-plated Metal Injection Molding MIM Parts Of Tungsten Copper Alloy Packaging Sheet
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Gold-plated Metal Injection Molding MIM Parts Of Tungsten Copper Alloy Packaging Sheet

Tungsten copper packaging sheet is a composite material composed of tungsten and copper, mainly used for packaging of electronic equipment. It has high thermal conductivity, high electrical conductivity, high strength and good toughness, and can quickly conduct the heat generated by electronic components while meeting the electrical connection requirements of electronic components.

product-500-500

 

Tungsten copper packaging sheet is a composite material composed of tungsten and copper, mainly used for packaging of electronic equipment. It has high thermal conductivity, high electrical conductivity, high strength and good toughness, and can quickly conduct the heat generated by electronic components while meeting the electrical connection requirements of electronic components. Tungsten copper packaging sheet also has good corrosion resistance and oxidation resistance, and can be used for a long time in harsh environments without damage. In addition, tungsten copper packaging sheet is also easy to process and manufacture. It can be manufactured by powder metallurgy process, and the shape and size can also be precisely controlled by processing and manufacturing process. Therefore, tungsten copper packaging sheet has broad application prospects and market potential in the field of electronic component packaging.

 

1. Composition Of Tungsten Copper Packaging Sheet

Tungsten copper packaging sheet is a composite material composed of tungsten and copper. Tungsten is a metal element with high melting point and high hardness, and has good thermal conductivity and mechanical properties. Copper is an excellent electrical conductor with good processing performance and corrosion resistance. By mixing tungsten and copper in a certain proportion, a tungsten copper packaging sheet with excellent performance can be prepared.

 

2. Characteristics Of Tungsten Copper Packaging Sheet

High thermal conductivity

Tungsten copper packaging sheet has high thermal conductivity and can quickly conduct away the heat generated by electronic components. Compared with traditional pure copper packaging materials, tungsten copper packaging sheet has higher thermal conductivity, which can more effectively reduce the operating temperature of electronic components and improve their stability and reliability. According to relevant data, the thermal conductivity of tungsten copper packaging sheet can reach more than several times that of pure copper.

 

High electrical conductivity

Tungsten copper packaging sheet also has high electrical conductivity, which can meet the electrical connection requirements of electronic components. This good electrical property enables tungsten copper packaging sheet to adapt to the electrical connection requirements of various electronic devices and ensure the normal operation of electronic components. Compared with pure copper, the electrical conductivity of tungsten copper packaging sheet is also relatively high.

 

High strength and good toughness

Tungsten copper packaging sheet has high strength and good toughness, which can withstand various stresses generated by electronic components during operation and ensure the stability and reliability of components. The strength and toughness of this material enable it to adapt to various complex working environments and ensure the performance and reliability of electronic components.

 

Good corrosion resistance

Tungsten copper encapsulation sheet has good corrosion resistance and can be used for a long time in harsh environments without damage. This corrosion resistance enables the tungsten copper encapsulation sheet to adapt to various complex working environments and ensure the stability and reliability of electronic components. Compared with pure copper, the corrosion resistance of tungsten copper encapsulation sheet has also been significantly improved.

 

Easy to process and manufacture

Tungsten copper encapsulation sheet can be manufactured by powder metallurgy process and has the characteristics of easy processing and manufacturing. This easy processing and manufacturing feature enables tungsten copper encapsulation sheet to meet the needs of large-scale production while reducing production costs. In addition, the shape and size of tungsten copper encapsulation sheet can also be precisely controlled through processing and manufacturing processes to meet various different application requirements.

Qinhuangdao Zhongwei Precision Machinery Co., Ltd. was established in 1997.

 

Advantages Of Our Company's Tungsten Copper And Tungsten Rhenium Alloys

1. No sintering activation elements are added, maintaining good thermal conductivity;

2. The metallographic appearance of the product shows that there is no copper pool phenomenon;

3. Relative density ≥ 99%, low porosity, good product air tightness, helium mass spectrometer leak test ≤ 5 × 10-9Pa·m3/S can be fully passed;

4. Good size control, surface finish and flatness;

5. Good electroplating quality and heat shock resistance.

 

We can provide tungsten copper sheets with specifications ranging from (0.1~10.0) mm×(10~200) mm×(30~500) mm, and can also provide deeply processed tungsten copper precision parts.

 

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