Mobile Phone SIM Card Tray MIM Parts

Mobile Phone SIM Card Tray MIM Parts

Enter the mobile phone settings--instructions, find the complete instructions--mobile phone introduction and quick use methods--SIM card installation and removal, follow the tutorial to remove or install the SIM card.

Product Introduction

Mobile phone SIM card tray MIM Parts

Item

Material

Production Process

Sintering Temperature

Mold

Custom

Mobile phone SIM card

17-4

Metal Injection Molding

1550℃

To be customized

Yes

Chemical Composition

C:≤0.07
Mn:≤1.00
Si:≤1.00
Cr:15.5~17.5
Ni:3.0~5.0
P:≤0.04
S:≤0.03
Cu:3.0~5.0
Nb+Ta:0.15~0.45

Available Materials

Low carbon stainless steel, titanium alloy (Ti, TC4), copper alloy, tungsten alloy, hard alloy, high temperature alloy (718, 713)

Finish

Dimensional Accuracy

Product Density

Appearance Treatment

Appropriate Weight

Roughness 1~5μm

(±0.1%~±0.5%)

92~95%

Mirror Reflection
Electrolytic polishing

0.03g~400g)

Mechanical properties

Tensile strength σb (MPa): aged at 480°C, ≥1310; aged at 550°C, ≥1060; aged at 580°C, ≥1000; aged at 620°C, ≥930
Conditional yield strength σ0.2 (MPa): aged at 480°C, ≥1180; aged at 550°C, ≥1000; aged at 580°C, ≥865; aged at 620°C, ≥725
Elongation δ5 (%): aging at 480°C, ≥10; aging at 550°C, ≥12; aging at 580°C, ≥13; aging at 620°C, ≥16
Reduction of area ψ (%): aging at 480°C, ≥40; aging at 550°C, ≥45; aging at 580°C, ≥45; aging at 620°C, ≥50
Hardness: solid solution, ≤363HB and ≤38HRC; 480℃ aging, ≥375HB and ≥40HRC; 550℃ aging, ≥331HB and ≥35HRC; 580℃ aging, ≥302HB and ≥31HRC; 620℃ aging, ≥277HB and ≥28HRC


Correct installation method of mobile phone SIM card
Enter the mobile phone settings--instructions, find the complete instructions--mobile phone introduction and quick use methods--SIM card installation and removal, follow the tutorial to remove or install the SIM card.
Standard SIM card, Micro SIM card, Nano SIM card, Micro SD card 


【Illustration】 

3

1: Take out the SIM card tray with the card removal needle
Tip: Please use moderate force when using the card removal needle
2: Place the SIM card and memory card
Tip: If you need to insert a memory card, you can only choose one of the SIM card and the memory card of card 2, and they cannot be used at the same time. The positions of the SIM card and the card tray should be aligned, and the metal contacts of the SIM card face down.


How to remove the phone card tray
1. Use the standard needle to take out the card
The non-standard card picking needle may not match, and the Mobile phone SIM card tray MIM Parts cannot be taken out. Please use the standard card removal pin, insert it vertically into the thimble hole, press inward with a little force, and take out the card tray after the card tray pops out. Please pay attention to distinguish the thimble hole from the microphone hole.
Note: 1) For the method of taking out the card, please refer to the user manual (enter Settings--System Management--Customer Service--User Manual--Mobile Phone Overview and Quick Start--Installation and Preparation)
2) If the card removal needle is lost, please do not use toothpicks or other easily broken objects to remove the card to avoid damage to the machine.

2. Please confirm whether the microphone hole is plugged in by mistake
Some models have the thimble hole and the microphone hole at the bottom of the phone, please find the position of the thimble hole and try again.
Note: You can refer to the user manual for the position of the microphone hole and the thimble hole (go to Settings--System Management--Customer Service--User Manual--Mobile Overview and Quick Start--Introduction to the Appearance of the Phone)

3. Service center testing
If the above methods fail to solve the problem, please back up the mobile phone data in advance, and take the mobile phone and the purchase certificate to the mobile phone brand customer service center for testing; enter the mobile phone brand official website/mobile phone brand mall APP--My--site query or click, select The address and contact information of the service center can be obtained in the current city. It is recommended to call in advance before going to avoid running empty, plan the itinerary reasonably, and travel safely.


Detection Systems

89


Metal Injection Molding Process

88

90

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